| Resistivity per inch at 25degreesC. |
0.07 |
0.06 |
0.035 |
| Body current carryingrRating at 25 degrees C |
32 amps |
48 amps |
64 amps |
| Maximum body temperature rise from 25degreesC at 1.5 times the current rating |
20C |
25C |
30C |
| Pin carrying current rating at 25degreesC |
11 amps |
| Maximum pin termperature rise from 25C at 1.5 times the current rating |
20C |
| Recommended PCB hole size |
0.070" (1.78 mm) |
| Recommended solder pad size |
0.110" - 0.120"
(2.794 mm - 3.048 mm) |
| Material |
alloy 110 copper .040" (1.016 mm) thick full hard |
| Finish |
electro tin plating per Mil-T-10272
(body surface only)
|
Outer insulation
(optional for single llayer) |
electric grade epoxy resin or Kapton HN |
| Dielectric strength (outer insulation) |
Epoxy (300 v/mil)
Kapton HN (5000 v/mil)
|
| Inner insulation for two layer construction |
electric grade polyester film |
| Dielectric strength (inner insulation) |
2000 vac/mil |
| High frequency vibration MIL STD 202F |
method 204D, Condition B (limited to 5 GS) |
| Random vibration Mil Std 202F |
Method 214A, Conditions I-E, for 30 min per axis |
| Mechanical shock Mil Std 202F |
Method 214B, Condition A 50G, 11 ms, half-sine; 3 22blows per direction, both directions of 3 axes (18 total shocks) |